@INPROCEEDINGS{7517563,
author={D. C. {Woodrum} and {Xuchen Zhang} and P. A. {Kottke} and Y. K. {Joshi} and A. G. {Fedorov} and M. S. {Bakir} and S. K. {Sitaraman}},
booktitle={2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)},
title={Reliability assessment of hydrofoil-shaped micro-pin fins},
year={2016},
volume={},
number={},
pages={295-300},
keywords={hydrodynamics;liquid films;microchannel flow;reliability;thermal management (packaging);high-pressure conditions;heat removal rates;capping layer;thermal-management system;liquid films;silicon micropin fins;microfluidic channel;two-phase refrigerant;micropin fin channel;hydrofoil-shaped micropin fins;reliability assessment;Stress;Fluids;Pins;Geometry;Heating;Microchannels;Silicon;reliability;microfluidic cooling;pin fin;stress concentration;two-phase flow},
doi={10.1109/ITHERM.2016.7517563},
ISSN={1087-9870},
month={May},}