@article{zhang2018benchmarking,
  title={Benchmarking Digital Die-to-Die Channels in 2.5-D and 3-D Heterogeneous Integration Platforms},
  author={Zhang, Yang and Zhang, Xuchen and Bakir, Muhannad S},
  journal={IEEE Transactions on Electron Devices},
  volume={65},
  number={12},
  pages={5460--5467},
  year={2018},
  publisher={IEEE}
}