@inproceedings{zheng2012electrical,
  title={Electrical and fluidic microbumps and interconnects for 3D-IC and silicon interposer},
  author={Zheng, Li and Bakir, Muhannad S},
  booktitle={2012 IEEE International SOC Conference},
  pages={159--164},
  year={2012},
  organization={IEEE}
}