@inproceedings{bakir2007, title={Fully compatible low cost electrical, optical, and fluidic I/O interconnect networks for ultimate performance 3D gigascale systems}, author={Bakir, Muhannad S. and Meindl, J.}, booktitle={Int. 3D System-in-Chip Conf.}, pages={}, year={2007}, organization={Proc. Int. 3D System-in-Chip Conf.} }