@inproceedings{bakir2007trimoda, title={‘trimoda’Wafer-Level Package: Fully Compatible Electrical, Optical, and Fluidic Chip I/O Interconnects}, author={Bakir, Muhannad S and Dang, Bing and Ogunsola, Oluwafemi O and Meindl, James D}, booktitle={2007 Proceedings 57th Electronic Components and Technology Conference}, pages={585--592}, year={2007}, organization={IEEE} }