@article{liu2013dimension, title={Dimension and liner dependent thermomechanical strain characterization of through-silicon vias using synchrotron X-ray diffraction}, author={Liu, Xi and Thadesar, Paragkumar A and Taylor, Christine L and Kunz, Martin and Tamura, Nobumichi and Bakir, Muhannad S and Sitaraman, Suresh K}, journal={Journal of Applied Physics}, volume={114}, number={6}, pages={064908}, year={2013}, publisher={AIP} }