@article{zhang2013silicon,
  title={Silicon micropin-fin heat sink with integrated TSVs for 3-D ICs: Tradeoff analysis and experimental testing},
  author={Zhang, Yue and Dembla, Ashish and Bakir, Muhannad S},
  journal={IEEE Transactions on Components, packaging and manufacturing technology},
  volume={3},
  number={11},
  pages={1842--1850},
  year={2013},
  publisher={IEEE}
}