@article{oh2015high, title={High-aspect ratio through-silicon vias for the integration of microfluidic cooling with 3D microsystems}, author={Oh, Hanju and Gu, Ja Myung and Hong, Sang Jeen and May, Gary S and Bakir, Muhannad S}, journal={Microelectronic Engineering}, volume={142}, pages={30--35}, year={2015}, publisher={Elsevier} }