@article{yang2016self,
  title={A self-aligning flip-chip assembly method using sacrificial positive self-alignment structures},
  author={Yang, Hyung Suk and Zhang, Chaoqi and Bakir, Muhannad S},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  volume={6},
  number={3},
  pages={471--477},
  year={2016},
  publisher={IEEE}
}