@article{oh2016low,
  title={Low-loss air-isolated through-silicon vias for silicon interposers},
  author={Oh, Hanju and Thadesar, Paragkumar A and May, Gary S and Bakir, Muhannad S},
  journal={IEEE Microwave and Wireless Components Letters},
  volume={26},
  number={3},
  pages={168--170},
  year={2016},
  publisher={IEEE}
}