@inproceedings{zhang20153d,
  title={3D IC with embedded microfluidic cooling: technology, thermal performance, and electrical implications},
  author={Zhang, Xuchen and Han, Xuefei and Sarvey, Thomas E and Green, Craig E and Kottke, Peter A and Fedorov, Andrei G and Joshi, Yogendra and Bakir, Muhannad S},
  booktitle={ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels},
  year={2015},
  organization={American Society of Mechanical Engineers Digital Collection}
}