@article{zheng2014novel, title={Novel electrical and fluidic microbumps for silicon interposer and 3-D ICs}, author={Zheng, Li and Zhang, Yue and Huang, Gang and Bakir, Muhannad S}, journal={IEEE Transactions on Components, Packaging and Manufacturing Technology}, volume={4}, number={5}, pages={777--785}, year={2014}, publisher={IEEE} }