@article{kumar2014airgap,
  title={Airgap interconnects: Modeling, optimization, and benchmarking for backplane, pcb, and interposer applications},
  author={Kumar, Vachan and Sharma, Rohit and Uzunlar, Erdal and Zheng, Li and Bashirullah, Rizwan and Kohl, Paul and Bakir, Muhannad S and Naeemi, Azad},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  volume={4},
  number={8},
  pages={1335--1346},
  year={2014},
  publisher={IEEE}
}