@inproceedings{chen2006,
  title={Copper interconnect bonding for polymer pillar I/O interconnects and three-dimensional (3D) integration applications},
  author={Chen, K.-N., Bakir, Muhannad S., Meindl, J. and Reif, R.},
  booktitle={TMS Electronics Materials Conf.},
  pages={},
  year={2006},
  organization={TMS Electronics Materials Conf.}
}