@inproceedings{dang2005chip, title={A Chip-Scale Cooling Scheme With Integrated Heat Sink and Thermal-Fluidic I/O Interconnects}, author={Dang, Bing and Joseph, Paul J and Wei, Xiaojin and Bakir, Muhannad S and Kohl, Paul A and Joshi, Yogendra K and Meindl, James D}, booktitle={ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference}, pages={605--610}, year={2005}, organization={American Society of Mechanical Engineers Digital Collection} }