@ARTICLE{ iet:/content/journals/10.1049/el.2012.3313, author = {Yue Zhang}, affiliation = {School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA}, author = {M. S. Bakir}, affiliation = {School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA}, keywords = {power dissipation;heterogeneous 3D IC stack;heterogeneous 3D IC application;junction temperature difference;memory-on-processor;processor-on-processor;independent interlayer microfluidic cooling;junction temperature reduction;thermal decoupling;independent microfluidic cooling;}, ISSN = {0013-5194}, language = {English}, abstract = {Presented for the first time is the implementation of independent microfluidic cooling of different tiers in a 3D stack based on their power dissipation. The impact of this approach on heterogeneous 3D IC stacks, such as memory-on-processor and processor-on-processor with different power dissipations, has been experimentally explored. The junction temperature difference between tiers with different power dissipation is decreased from 12 to 7°C. Significant junction temperature reduction and thermal decoupling are achieved by this approach compared to air-cooling.}, title = {Independent interlayer microfluidic cooling for heterogeneous 3D IC applications}, journal = {Electronics Letters}, issue = {6}, volume = {49}, year = {2013}, month = {March}, pages = {404-406(2)}, publisher ={Institution of Engineering and Technology}, copyright = {© The Institution of Engineering and Technology}, url = {https://digital-library.theiet.org/content/journals/10.1049/el.2012.3313} }