@inproceedings{huang2007power,
  title={Power delivery for 3D chip stacks: Physical modeling and design implication},
  author={Huang, Gang and Bakir, Muhannad and Naeemi, Azad and Chen, Howard and Meindl, James D},
  booktitle={2007 IEEE Electrical Performance of Electronic Packaging},
  pages={205--208},
  year={2007},
  organization={IEEE}
}