@inproceedings{kaul2020soc+,
  title={BEOL-Embedded 3D Polylithic Integration: Thermal and Interconnection Considerations},
  author={Kaul, Ankit and Kochupurackal Rajan, Sreejith and Hossen, Md Obaidul and S. May, Gary and Bakir, Muhannad S.},
  booktitle=2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
  pages={},
  year={2020},
}