@inproceedings{king20083d,
  title={3D stacking of chips with electrical and microfluidic I/O interconnects},
  author={King, Calvin R and Sekar, Deepak and Bakir, Muhannad S and Dang, Bing and Pikarsky, Joel and Meindl, James D},
  booktitle={2008 58th Electronic Components and Technology Conference},
  pages={1--7},
  year={2008},
  organization={IEEE}
}