@inproceedings{sarvey2014thermal,
  title={Thermal and electrical effects of staggered micropin-fin dimensions for cooling of 3D microsystems},
  author={Sarvey, Thomas E and Zhang, Yang and Zhang, Yue and Oh, Hanju and Bakir, Muhannad S},
  booktitle={Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)},
  pages={205--212},
  year={2014},
  organization={IEEE}
}