@inproceedings{sekar20083d, title={A 3D-IC technology with integrated microchannel cooling}, author={Sekar, Deepak and King, Calvin and Dang, Bing and Spencer, Todd and Thacker, Hiren and Joseph, Paul and Bakir, Muhannad and Meindl, James}, booktitle={2008 International Interconnect Technology Conference}, pages={13--15}, year={2008}, organization={IEEE} }