@inproceedings{thadesar2013fabrication, title={Fabrication and characterization of novel photodefined polymer-enhanced through-silicon vias for silicon interposers}, author={Thadesar, Paragkumar A and Bakir, Muhannad S}, booktitle={2013 IEEE 63rd Electronic Components and Technology Conference}, pages={1970--1974}, year={2013}, organization={IEEE} }