@inproceedings{thadesar2013novel,
  title={Novel through-silicon via technologies for 3D system integration},
  author={Thadesar, Paragkumar A and Dembla, Ashish and Brown, Devin and Bakir, Muhannad S},
  booktitle={2013 IEEE International Interconnect Technology Conference-IITC},
  pages={1--3},
  year={2013},
  organization={IEEE}
}