@inproceedings{thadesar2015fabrication,
  title={Fabrication and characterization of mixed-signal polymer-enhanced silicon interposer featuring photodefined coax TSVs and high-Q inductors},
  author={Thadesar, Paragkumar A and Bakir, Muhannad S},
  booktitle={2015 IEEE 65th Electronic Components and Technology Conference (ECTC)},
  pages={281--286},
  year={2015},
  organization={IEEE}
}