@inproceedings{zhang2014mechanically,
  title={Mechanically flexible interconnects with highly scalable pitch and large stand-off height for silicon interposer tile and bridge interconnection},
  author={Zhang, Chaoqi and Yang, Hyung Suk and Bakir, Muhannad S},
  booktitle={2014 IEEE 64th Electronic Components and Technology Conference (ECTC)},
  pages={13--19},
  year={2014},
  organization={IEEE}
}