@inproceedings{zhang2014thermal,
  title={Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation},
  author={Zhang, Yang and Sarvey, Thomas E and Bakir, Muhannad S},
  booktitle={2014 International 3D Systems Integration Conference (3DIC)},
  pages={1--5},
  year={2014},
  organization={IEEE}
}