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            - 2024 Best Paper Award, IEEE Transactions on Components, Packaging and Manufacturing Technology (TCPMT), Advanced Packaging Technologies Category
 
	- 2024 IEEE Electronic Components and Technology Conference (ECTC) Intel Outstanding Student Paper Award
 
	- 2023 Best Paper Award, IEEE Transactions on Components, Packaging and Manufacturing Technology (TCPMT), Advanced Packaging Category
 
	- 2023 IEEE Electronic Components and Technology Conference (ECTC) Intel Outstanding Paper Award
 
	- 2022 3rd Place Best Student Paper Award, IEEE International Microwave Symposium (IMS)
 
	- 2019 Best Student Paper Award, IEEE 3D Integrated Systems Conference
 
	- 2019 Best Student Poster Award, SRC/DARPA JUMP ASCENT Annual Review
 
	- 2017 Best Paper Award IEEE Transactions on Components, Packaging and Manufacturing Technology (TCPMT), Characterization and Modeling Category
 
	- 2016 IEEE Electronic Components and Technology Conference (ECTC) Best Oral Session Paper Award
 
	- 2016 SRC TECHCON Best in Session Award
 
	- 2016 Outstanding Abstract Achievement Award, American Society of Hematology
 
	- 2015 IEEE Global Interposer Technology Workshop Best Student Paper Award
 
	- 2014 Best Paper Award IEEE Transactions on Components, Packaging and Manufacturing Technology (TCPMT), Advanced Packaging Technologies Category
 
	- 2014 IEEE Global Interposer Technology Workshop First Place Best Student Paper Award
 
	- 2014 SRC TECHCON Best in Session Paper Award
 
	- 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Best Poster Award, Thermal Track
 
	- 2013 IEEE International Interconnect Technology Conference (IITC) Best Student Paper Award
 
	- 2013 IEEE Electronic Components and Technology Conference (ECTC) Outstanding Interactive Presentation Paper Award
 
	- 2013 SRC TECHCON Best in Session Paper Award
 
	- 2013 IEEE Global Interposer Technology Workshop Third Place Best Student Paper Award
 
	- 2012 IEEE Electronic Components and Technology Conference (ECTC) Outstanding Interactive Presentation Paper Award
 
	- 2012 IEEE Global Interposer Technology Workshop First Place Best Student Paper Award
 
	- 2011 Global Interposer Technology Conference Best Student Poster Award
 
	- 2011 SRC TECHCON Best in Session Paper Award     
 
	- 2011 IMAPS/IEEE-CPMT Advanced Technology Workshop on Optoelectronic Packaging Best Student Paper Award
 
	- 2010 IETE-CDIL Award for Industry (Best Journal Paper Award from IETE)
 
	- 2010 SRC TECHCON Best in Session Paper Award     
 
	- 2009 International Symposium on Microelectronics Best Paper in Session Award
 
	- 2009 International Symposium on Microelectronics Best Student Paper Award   
 
	- 2009 SRC TECHCON Best in Session Paper Award       
 
	- 2008 IEEE International Interconnect Technology Conference (IITC) Best Student Paper Award
 
	- 2008 IEEE Electronic Components and Technology Conference (ECTC) Motorola Electronic Packaging Fellowship Student Paper Award
 
	- 2007 IEEE Custom Integrated Circuits Conference (CICC) Best Invited Paper Award
 
	- 2007 IEEE Electronic Components and Technology Conference (ECTC) Outstanding Paper Award
 
	- 2006 IEEE International Interconnect Technology Conference (IITC) Best Student Paper Award
 
	- 2005 IEEE International Interconnect Technology Conference (IITC) Best Student Paper Award
 
	- 2002 IEEE Electronic Components and Technology Conference (ECTC) Best Paper Award