Monolithic integrated circuits (ICs) have progressed at an unprecedented rate of innovation in the past 60 years. They have revolutionized every aspect of human life: communication, productivity, transportation, health, security, and manufacturing, for example. However, to meet the performance, power, and cost metrics of future electronic systems, polylithic integration has emerged as a critical enabler for the next phase of Moore’s Law. Polylithic integration enables the concatenation of heterogeneous ICs of various functionalities (digital, analog, photonic, and mm-wave) and materials in a manner that mimics monolithic-like densities, yet utilizes advanced off-chip ‘2.5D’ and ‘3D’ heterogeneous interconnects and packaging to provide flexibility in fabrication and design, improved scalability, improved performance and energy efficiency, reduced development time, and reduced cost. This new era of Moore’s Law is a game changer and will impact all applications, especially high-performance compute, machine learning, edge intelligence, autonomous vehicles, augmented/virtual reality, and healthcare.

Polylithic ICs will be enabled by radical 2.5D and 3D integration architectures that require co-design and co-invention of the thermal technologies, power delivery networks, and signaling (electrical and optical) networks to unleash the ultimate performance of silicon nanoelectronic systems. Our lab, explores the co-design, fabrication, and technology demonstration of such emerging 2.5D and 3D ICs and applies these advances to emerging new applications such as machine learning and healthcare.

 

Recent News

  • Shengtao Yu Wins Intel Outstanding Student Paper Award at 73rd ECTC
    February 2024
    Shengtao Yu Wins Intel Outstanding Student Paper Award at 73rd ECTC
  • I3DS members gathered at Souper Jenny in the Atlanta History Center. We celebrated our achievements and explored exciting research topics, fostering innovation in this iconic setting.
    September 2023
    I3DS members gathered at Souper Jenny in the Atlanta History Center. We celebrated our achievements and explored exciting research topics, fostering innovation in this iconic setting.
  • Bakir to Serve as Interim Director of Packaging Research Center
    October 2022
    Bakir to Serve as Interim Director of Packaging Research Center

Recent Publications

  1. J. Sharda, M. Manley, A. Kaul, W. Li, M. Bakir and S. Yu, "Design and Thermal Analysis of 2.5D and 3D Integrated System of a CMOS Image Sensor and a Sparsity-Aware Accelerator for Autonomous Driving," in IEEE Journal of the Electron Devices Society, doi: 10.1109/JEDS.2024.3354621

  2. S. Oh, T. Zheng and M. S. Bakir, "Electrical Characterization of Shielded TSVs with Airgap Isolation for RF/mmWave Applications," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3358102.

  3. B. Chung, M. Zia, K. A. Thomas, J. A. Michaels, A. Jacob, A. Pack, M. J. Williams, K. Nagapudi, L. H. Teng, E. Arrambide, L. Ouellette, N. Oey, R. Gibbs, P. Anschutz, J. Lu, Y. Wu, M. Kashefi, T. Oya, R. Kersten, A. C. Mosberger, S. O'Connell, R. Wang, H. Marques, A. R. Mendes, C. Lenschow, G. Kondakath, J. J. Kim, W. Olson, K. N. Quinn, P. Perkins, G. Gatto, A. Thanawalla, S. Coltman, T. Kim, T. Smith, B. Binder-Markey, M. Zaback, C. K. Thompson, S. Giszter, A. Person, M. Goulding, E. Azim, N. Thakor, D. O'Connor, B. Trimmer, S. Q. Lima, M. R. Carey, C. Pandarinath, R. M. Costa, J. A. Pruszynski, M. Bakir, S. J. Sober, "Myomatrix arrays for high-definition muscle recording," in eLife, vol. 12, no. RP88551, 2023. [Online]. Available: https://doi.org/10.7554/eLife.88551.3

  4. W. Li, M. Manley, J. Read, A. Kaul, M. S. Bakir and S. Yu, "H3DAtten: Heterogeneous 3-D Integrated Hybrid Analog and Digital Compute-in-Memory Accelerator for Vision Transformer Self-Attention," in IEEE Transactions on Very Large Scale Integration (VLSI) Systems, doi: 10.1109/TVLSI.2023.3299509.