lab-member-pic
 

Carl Li

  • Masters Alumni

 carlli@gatech.edu
 
 

Biography

  • Ph.D. student in Electrical and Computer Engineering, Georgia Institute of Technology
  • BS in Material Science, National Cheng Kung University

Research Interests

Thesis

All Publications

  1. Z. J. Devereaux, M. Manley, M.-J. Li, J. Hollin, N. M. K. Linn, M. S. Bakir, A. Kummel and C. H. Winter, “Studies Toward Highly Selective Cobalt Metal ALD on Copper Features for Heterogeneous Chiplet Integration”, 6th Area Selective Deposition Workshop, San Francisco, CA, Apr. 2022.​

  2. M. Manley, A. Kaul, M. -J. Li and M. S. Bakir, "Ultra-Dense 3D Polylithic Integration Technology", Government Microcircuit Applications & Critical Technology Conf., Miami, FL, Mar. 2022.

  3. M. -J. Li and M. S. Bakir, "3-D Integrated Chiplet Encapsulation (3-D ICE): High-Density Heterogeneous Integration Using SiO2-Reconstituted Tiers," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 12, pp. 2242-2245, Dec. 2021.

  4. M. -J. Li et al., "Cu–Cu Bonding Using Selective Cobalt Atomic Layer Deposition for 2.5-D/3-D Chip Integration Technologies," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 12, pp. 2125-2128, Dec. 2020.

  5. S. Kochupurackal Rajan, M. Li, G.S. May, and M.S. Bakir, "High density and low-temperature interconnection enabled by mechanical self-alignment and electroless plating" in Proc. IEEE Int. 3D Systems Integration Conf. (3DIC), Sendai, Japan, Oct. 2019.