lab-member-pic
 

Euichul Chung

  • Ph.D Student

 echung62@gatech.edu
 
 

Biography

  • Ph.D. student in Mechanical Engineering, Georgia Institute of Technology
  • B.S. in Mechanical Engineering, Yonsei University

Research Interests

Thesis

All Publications

  1. E. Chung et al., "Electrical-Thermal Co-analysis of Through-Silicon Vias (TSVs) Integrated within Micropin-fin Heatsink for 3D Heterogeneous Integration (HI)," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3452637.