lab-member-pic
 

Joe L. Gonzalez

  • Ph.D Alumni

 jgonzalez34@gatech.edu
 
 

Biography

  • Ph.D. student in Electrical and Computer Engineering at Georgia Institute of Technology
  • MS in Electrical and Computer Engineering at Georgia Institute of Technology
  • BS in Electrical and Computer Engineering at Georgia Institute of Technology

Research Interests

Thesis GONZALEZ-DISSERTATION-2021.pdf

All Publications

  1. J. R. Brescia, J. L. Gonzalez, T. Zheng and M. S. Bakir, "Replaceable Integrated Chiplet (PINCH) Assembly for Heterogeneous Integration", Government Microcircuit Applications & Critical Technology Conf., Miami, FL, Mar. 2022.

  2. J. L. Gonzalez, J. R. Brescia, T. Zheng, S. Kochupurackal Rajan and M. S. Bakir, "A Die-Level, Replaceable Integrated Chiplet (PINCH) Assembly Using a Socketed Platform, Compressible MicroInterconnects, and Self-Alignment," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 12, pp. 2069-2076, Dec. 2021.

  3. J. L. Gonzalez, S. Kochupurackal Rajan, J. R. Brescia and M. S. Bakir, "A Substrate-Agnostic, Submicrometer PSAS-to-PSAS Self-Alignment Technology for Heterogeneous Integration," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 12, pp. 2061-2068, Dec. 2021.

  4. P. Yeon, S. Kochupurackal Rajan, et al., "Microfabrication, Coil Characterization, and Hermetic Packaging of Millimeter-Sized Free-Floating Neural Probes," in IEEE Sensors Journal, vol. 21, no. 12, pp. 13837-13848, 15 June, 2021.

  5. P. Jo, S. Kochupurackal Rajan, J. Gonzalez and M. S. Bakir, "Polylithic Integration of 2.5-D and 3-D Chiplets Enabled by Multi-Height and Fine-Pitch CMIs,"  in IEEE Transactions on Components, Packaging and Manufacturing Technology, Jul.2020.

  6. J. L. Gonzalez, T. Zheng, S. Kochupurackal Rajan, and M. S. Bakir, “Package Testing using a Socketed Heterogeneous 2.5D/3D Integration Module (SHIM) for mm-wave Applications,” Proceedings of the 2020 GOMAC-Tech – Government Microcircuit Applications and Critical Technology Conference, 2020.

  7. C. Wan, J. L. Gonzalez, T. Fan, A. Adibi, T. K. Gaylord, and M. S. Bakir, "Fiber-Interconnect Silicon Chiplet Technology for Self-Aligned Fiber-to-Chip Assembly," IEEE Photonics Technology Letters, vol. 31, no. 16, pp. 1311-1314, 2019.

  8. M. O. Hossen, J. L. Gonzalez, and M. S. Bakir, "Thermomechanical Analysis and Package-Level Optimization of Mechanically Flexible Interconnects for Interposer-on-Motherboard Assembly," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 12, pp. 2081-2089, 2018.

  9. J. L. Gonzalez, P. K. Jo, R. Abbaspour, and M. S. Bakir, "A Disposable and Self-Aligned 3-D Integrated Bio-Sensing Interface Module for CMOS Cell-Based Biosensor Applications," IEEE Electron Device Letters, vol. 39, no. 8, pp. 1215-1218, 2018.

  10. J. L. Gonzalez, P. K. Jo, R. Abbaspour, and M. S. Bakir, "Flexible Interconnect Design using a Mechanically-focused, Multi-Objective Genetic Algorithm," IEEE Journal of Microelectromechanical Systems, vol. 27, no. 4, pp. 677-685, Aug. 2018.

  11. P. K. Jo, X. Zhang, J. L. Gonzalez, G. S. May, and M. Bakir, "Heterogeneous Multi-Die Stitching Enabled by Fine-Pitch & Multi-Height Compressible MicroInterconnects (CMIs)," IEEE Transactions on Electron Devices, vol. 65, no. 7, pp. 2957-2963, July. 2018.

  12.  P. Yeon, J. L. Gonzalez, M. Zia, S. Kochupurackal Rajan, G. S. May, M. S. Bakir, and M. Ghovanloo, "Microfabrication, Assembly, and Hermetic Packaging of mm-Sized Free-Floating Neural Probes," in Proc. IEEE Biomedical Circuits and Systems Conference (BioCAS), Turin, Italy, Oct. 2017.

  13.  P. K. Jo, M. Zia, J. L. Gonzalez, and M. S. Bakir, "Dense and highly elastic compressible microinterconnects (CMIs) for electronic microsystems," in Proc. 67th IEEE Electronic Components and Technology Conf. (ECTC), Orlando, FL, May. 2017.

  14. P. K. Jo, M. Zia, J. L. Gonzalez, H. Oh, and M. S. Bakir, "Design, fabrication, and characterization of dense compressible microinterconnects,"IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 7, pp. 1003-1010, May. 2017.

  15. M. Zia, T. Chi, J. Park, A. Su, J. L. Gonzalez, P. K. Jo, M. P. Styczynski, H. Wang, and M. S. Bakir, "A 3D integrated electronic microplate platform for lowcost repeatable biosensing applications," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 6, no. 12, pp. 1827-1833, Dec. 2016.

  16.  M. Zia, T. Chi, C. Zhang, P. Thadesar, T. Hookway, J. Gonzalez, T. McDevitt, H. Wang, and M. S. Bakir, "A microfabricated electronic microplate platform for low-cost repeatable bio-sensing applications," in Proc. IEEE International Electron Devices Meeting (IEDM), Washington, DC, Dec. 2015.

  17. . M. Zia, C. Zhang, P. Thadesar, T. Hookway, T. Chi, J. Gonzalez, T. McDevitt, H. Wang,  and M. S. Bakir, "Fabrication of and cell growth on silicon membranes with high density TSVs for bio-sensing applications," in Proc. IEEE Biomedical Circuits and Systems Conference (BioCAS), Atlanta, GA, Oct. 2015.