J. L. Gonzalez, P. K. Jo, R. Abbaspour, and M. S. Bakir, "A Disposable and Self-Aligned 3-D Integrated Bio-Sensing Interface Module for CMOS Cell-Based Biosensor Applications," IEEE Electron Device Letters, vol. 39, no. 8, pp. 1215-1218, 2018.

J. L. Gonzalez, P. K. Jo, R. Abbaspour, and M. S. Bakir, "Flexible Interconnect Design using a Mechanically-focused, Multi-Objective Genetic Algorithm," IEEE Journal of Microelectromechanical Systems, vol. 27, no. 4, pp. 677-685, Aug. 2018.

J. C. Ciciliano, R. Abbaspour, J. Woodall, C. Wu, M. S. Bakir, and W. A. Lam, "Probing blood cell mechanics of hematologic processes at the single micron level," Lab on a Chip, vol. 17, no. 22, pp. 3804-3816, Nov. 2017.

R. Abbaspour, D. K. Brown, and M. S. Bakir, "Fabrication and electrical characterization of sub-micron diameter through-silicon via for heterogeneous three-dimensional integrated circuits," Journal of Micromechanics and Microengineering, vol. 27, no. 2, pp. 025011-1-025011-8, Jan. 2017.

Y. Song, R. Abbaspour, M. S. Bakir, and S. K. Sitaraman, "Thermal annealing effects on copper microstructure in Through-Silicon-Vias," in IEEE Intersociety Conf. on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), Las Vegas, NV, May 2016.

R. Abbaspour, D. C. Woodrum, P. A. Kottke, T. E. Sarvey, C. E. Green, Y. K. Joshi, A. G. Fedorov, S. K. Sitaraman, and M. S. Bakir, "Combined finned microgap with dedicated extreme-microgap hotspot flow for high performance thermal management," in IEEE Intersociety Conf. on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), Las Vegas, NV, May 2016.

J. Ciciliano, R. Abbaspour, C. Wu, M. S. Bakir, and W. A. Lam, "A microengineered matrix to decouple the biophysical and biochemical mechanisms of blood cell interactions with thrombi and vascular wall matrices," Blood Journal by American Society of Hematology, vol. 128, no. 22, p. 555, Dec. 2016.