Biography
Taesoo Kim is a Ph.D. student in Electrical and Computer Engineering at Georgia Tech. His research focuses on chiplet-based system-in-package (SiP) architectures for high-performance AI hardware, with emphasis on signal and power integrity in advanced interconnect design. He received his B.S. and M.S. degrees in Electrical Engineering from KAIST, where he worked on next-generation high-bandwidth memory (HBM) architecture, interconnect optimization, and packaging solutions for AI computing systems.
Research Interests
- 3D heterogeneous integration
- Signal integrity and power integrity optimization
- Semiconductor packaging