Y. Zhang, T. E. Sarvey, Y. Zhang, M. Zia and M. S. Bakir, "Numerical and experimental exploration of thermal isolation in 3D systems using air gap and mechanically flexible interconnects," in IEEE International Interconnect Technology Conf. / Advanced Metallization Conf. (IITC/AMC), San Jose, CA, May. 2016.

H. Oh, Y. Zhang, L. Zheng, G. S. May, and M. S. Bakir, "Fabrication and characterization of electrical interconnects and microfluidic cooling for 3D ICs with silicon interposer," Heat Transf. Eng., vol. 7632, pp. 1-41, Dec. 2015 (Invited).

Y. Zhang, Y. Zhang, T. E. Sarvey, C. Zhang, M. Zia, M. S. Bakir, "Thermal isolation using air gap and mechanically flexible interconnects for heterogeneous 3D ICs," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 6. no. 1, pp. 31-39, Dec. 2015.

Y. Zhang, Y. Zhang, M. S. Bakir, "Thermal design and constraints for heterogeneous integrated chip stacks and isolation technology using air gap and thermal bridge," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol.4, no.12, pp.1914-1924, Dec. 2014.

W. Wahby, L. Zheng, Y. Zhang, and M. Bakir, "A virtual integration platform for 3DIC design space exploration," in Proc. SRC Techcon, Austin, TX, Sep. 2014.

H. Oh, Y. Zhang, L. Zheng, and M. Bakir,"Electrical interconnect and microfluidic cooling within 3D ICs and silicon interposer," in Proc. Int. Tech. Conf. and Expo. Packaging and Integration of Electronic and Photonic Microsystems and Int. Conf. Nanochannels, Microchannels, and Minichannels (InterPACKICNMM), Chicago, IL, Aug. 2014.

T. E. Sarvey, Y. Zhang, Y. Zhang, H. Oh, and M. S. Bakir, "Thermal and electrical effects of staggered micropin-fin dimensions for cooling of 3D microsystems,"in IEEE Intersociety Conf. on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), Orlando, FL, May 2014.

L. Zheng, Y. Zhang, and M. Bakir, "Novel electrical and fluidic microbumps for silicon interposer and 3D-ICs," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 4, no. 5, pp. 777-785, May 2014.

S. A. Isaacs, Y. Joshi, Y. Zhang, M. Bakir, and Y. J. Kim, "Two-phase flow and heat transfer in pin-fin enhanced micro-gaps with non-uniform heating," in Proc. ASME Int. Conf. on Micro/Nanoscale Heat and Mass Transfer, Hong Kong, China, Dec. 2013.

Y. Zhang, A. Dembla, and M. S. Bakir, "Silicon micropin-fin heat sink with integrated TSVs for 3-D ICs: trade-off analysis and experimental testing," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 3, no. 11, pp. 1842-1850, Nov. 2013.

Y. Zhang, L. Zheng, and M. S. Bakir, "3-D stacked tier-specific microfluidic cooling for heterogeneous 3-D ICs," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 3, no. 11, pp. 1811-1819, Nov. 2013.

Y. Zhang, H. Oh, and M. Bakir, "Within-tier cooling and thermal isolation technologies for heterogeneous 3D ICs," in Proc. IEEE Int. 3D Systems Integration Conf. (3DIC), San Francisco, CA, Oct. 2013.

H. Oh, A. Dembla, Y. Zhang, and M. Bakir "High aspect ratio TSVs in micro-pinfin heat sinks for 3D ICs," in Proc. SRC TECHCON, Austin, TX, Sep. 2013.

Y. Zhang, L. Zheng, and M. Bakir, "Tier-independent microfluidic cooling for heterogeneous 3D ICs with nonuniform power dissipation," in Proc. IEEE International Interconnect Technology Conf. (IITC), Kyoto, Japan, June 2013.

L. Zheng, Y. Zhang and M. Bakir, "Design, fabrication and assembly of novel electrical and microfluidic I/Os for 3-D chip stack and silicon interposer," in Proc. 63rd IEEE Electronic Components and Technology Conf. (ECTC), Las Vegas, NV, May 2013.

Y. Zhang and M. S. Bakir, "Independent interlayer microfluidic cooling for heterogeneous 3D IC applications," Electronics Letters, vol. 49, no. 6, pp. 404-406, Mar. 2013.

A. Dembla, Y. Zhang, and M. Bakir, "Fine pitch TSV integration in silicon micropin-fin heat sinks for 3D ICs," in Proc. SRC TECHCON, Austin, TX, Sep. 2012.

A. Dembla, Y. Zhang, and M. Bakir, "High aspect ratio TSVs in micropin-fin heat sinks for 3D ICs," in Proc. IEEE Int. Conf. Nanotechnology, Birmingham, England, Aug. 2012.

S. A. Isaacs, Yoon Jo Kim, A. J. McNamara, Y. Joshi, Y. Zhang and M. S. Bakir, "Two-phase flow and heat transfer in pin-fin enhanced micro-gaps," 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, 2012, pp. 1084-1089.

A. Dembla, Y. Zhang, and M. Bakir, "Fine pitch TSV integration in silicon micropin-fin heat sinks for 3D ICs," in Proc. IEEE International Interconnect Technology Conf. (IITC), San Jose, CA, June 2012.

Y. Zhang, A. Dembla, Y. Joshi, and M. Bakir, "3D stacked microfluidic cooling for high-performance 3D ICs" in Proc. 62nd IEEE Electronic Components and Technology Conf. (ECTC), San Diego, CA, 2012.

Y. Zhang, C. King, J. Zaveri, Y. J. Kim, V. Sahu, Y. Joshi, and M. Bakir, "Coupled electrical and thermal 3D IC centric microfluidic heat sink design and technology," in Proc. 61st IEEE Electronic Components and Technology Conf. (ECTC), Orlando, FL, May 2011.

M. Bakir, P. Thadesar, C. King, J. Zaveri, H. Yang, C. Zhang, Y. Zhang, "Revolutionary innovation in system interconnection: A new era for the IC," in Proc. Photonics West, Proc. of SPIE, Feb. 2011.

Y. Zhang, J. Zaveri, C. King, and M. Bakir, "Coupled electrical and thermal 3D IC centric microfluid heat sink design," in Proc. SRC Techcon, 2010.