lab-member-pic
 

Zhonghao Zhang

  • Ph.D Student

 Zzhang3093@gatech.edu
 
 

Biography

  • Ph.D. student in Electrical and Computer Engineering, Georgia Institute of Technology
  • BS in Electrical Engineering, University of Illinois at Urbana-Champaign
  • BE in Electrical Engineering and Automation, Zhejiang University

Research Interests

  • 2.5D/3D Heterogeneous Integration
  • RF/mm-wave modeling and characterization

Thesis

All Publications

  1. Z. Zhang, P. K. Jo, S. Oh and M. S. Bakir, "Direct Die-to-die Bridging for Heterogeneous mm-wave Circuits Enabled by Fused-Silica Stitch-Chip Technology," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2025.3587609.

  2. Z. Zhang, T. Zheng and M. Bakir, "High-Frequency Multi-Chip RF Module Enabled by Fused-Silica Stitch-Chip Technology: RF and Interconnect Characterization," 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, TX, USA, 2025, pp. 2230-2236, doi: 10.1109/ECTC51687.2025.00379.

  3. S. Oh, Z. Zhang, G. Yan, P. K. Jo and M. S. Bakir, "Heterogeneous Integration Enabled by 3-D Stitch-Chips," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 15, no. 1, pp. 113-122, Jan. 2025, doi: 10.1109/TCPMT.2024.3507552.

  4. S. Penta, T. Zheng, E. Tremble, A. Chakravarti, A. Sigler, Z. Zhang, C. Benes, M. S. Bakir and W. Sauter, "Performance Evaluation of UCIe-based Die-to-Die Interface on Low-Cost 2D Packaging Technology," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 274-278, doi: 10.1109/ECTC51529.2024.00052.