Y. Zhang, X. Zhang, and M. S. Bakir, "Benchmarking Digital Die-to-Die Channels in 2.5-D and 3-D Heterogeneous Integration Platforms," IEEE Transactions on Electron Devices, vol. 65, no. 12, pp. 5460-5467, 2018.

P. K. Jo, M. O. Hossen, X. Zhang, Y. Zhang, and M. S. Bakir, "Heterogeneous Multi-Die Stitching: Technology Demonstration and Design Considerations," in Proc. 68th IEEE Electronic Components and Technology Conf. (ECTC), San Diego, CA, May. 2018.

P. Asrar, X. Zhang, C. E. Green, M. S. Bakir, Y. K. Joshi, "Flow boiling of R245fa in a microgap with staggered circular cylindrical pin fins," Inter. Jour. of Heat and Mass Transfer, Volume 121, Pages 329-342, 2018.

M. H. Nasr, C. E. Green, P. A. Kottke, X. Zhang, T. E. Sarvey, Y. K. Joshi, M. S. Bakir, A. G. Fedorov, "Flow regimes and convective heat transfer of refrigerant flow boiling in ultra-small clearance microgaps," Inter. Jour. of Heat and Mass Transfer, Volume 108, Part B, Pages 1702-1713, 2017.

 H. Oh, X. Zhang, P. K. Jo, G. S. May, and M. S. Bakir, "Monolithic-like heterogeneously integrated microsystems using dense low-loss interconnects," in Proc. IEEE Silicon Monolithic Integrated Circuits in RF Systems (SiRF), Phoenix, AZ, Jan. 2017. (invited).

X. Zhang, P. K. Jo, M. Zia, G. May, and M. S. Bakir, "Heterogeneous interconnect stitching technology with compressible microinterconnects for dense multi-die integration," IEEE Electron Device Letters, vol. 38, no. 2, pp. 255-257, Feb. 2017.

Y. Zhang, X. Zhang, W. Wahby, and M. S. Bakir, "Design considerations for 2.5-D and 3-D integration accounting for thermal constraints," in Proc. IEEE Int. 3D Systems Integration Conf. (3DIC), San Francisco, CA, Nov. 2016.

V. Kumar, H. Oh, X. Zhang, L. Zheng, M. S. Bakir, and A. Naeemi, "Impact of on-chip interconnect on the performance of 3D integrated circuits with through silicon vias Part I," IEEE Transaction on Electron Devices, vol. 63, no. 6, pp. 2503-2509, June 2016

X. Zhang, V. Kumar, H. Oh, L. Zheng, G. May, A. Naeemi, and M. S. Bakir, "Impact of on-chip interconnect on the performance of 3D integrated circuits with through silicon vias Part II," IEEE Transactions on Electron Devices, vol. 63, no. 6, pp. 2510-2516, June 2016

D. Lorenzini, C. Green, T. E. Sarvey, X. Zhang, Y. Hu, A. G. Fedorov, M. S. Bakir, Y. Joshi, "Embedded single phase microfluidic thermal management for non-uniform heating and hotspots using microgaps with variable pin fin clustering," Inter. Jour. of Heat and Mass Transfer, Volume 103, Pages 1359-1370, 2016.

M. H. Nasr, C. E. Green, P. E. Kottke, X. Zhang, T. E. Sarvey, Y. K. Joshi, M. S. Bakir, A. G. Fedorov, "Extreme-microgap based hotspot thermal management with refrigerant flow boiling," in IEEE Intersociety Conf. on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), Las Vegas, NV, May 2016.

X. Zhang,  M. H. Nasr, D. C. Woodrum, C. E. Green, P. A. Kottke, T. E. Sarvey, Y. K. Joshi, S. K. Sitaraman, A. G. Fedorov, and M. S. Bakir, "Design, microfabrication and thermal characterization of the hotspot cooler testbed for convective boiling experiments in extreme-micro-gap with integrated micropin-fins and heat Loss minimization," in IEEE Intersociety Conf. on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), Las Vegas, NV, May 2016.

P. Asrar, X. Zhang, C. E. Green, P. A. Kottke, T. E. Sarvey, A. G. Fedorov, M. S. Bakir, Y. K. Joshi, "Flow visualization of two phase flow of R245fa in a microgap with integrated staggered pin fins," in Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), San Jose, CA, Mar. 2016.

D. C. Woodrum, X. Zhang, P. A. Kottke, Y. K. Joshi, A. G. Fedorov, M. S. Bakir, and S. K. Sitaraman, "Reliability assessment of hydrofoil-shaped micro-pin fins subjected to high performance coolant," in IEEE The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), Las Vegas, NV, May 2016.

P. Asrar, X. Zhang, C. E. Green, P. A. Kottke, T. E. Sarvey, A. G. Fedorov, M. S. Bakir, and Y. K. Joshi, "Flow boiling of R245fa in a microgap with integrated staggered pin fins," in IEEE Intersociety Conf. on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), Las Vegas, NV, May 2016.

H. Oh, X. Zhang, G. May, and M. Bakir, "High-frequency analysis of embedded microfluidic cooling within 3-D ICs using a TSV testbed," in Proc. 66th IEEE Electronic Components and Technology Conf. (ECTC), Las Vegas, NV, May. 2016.

X. Zhang, X. Han, T. E. Sarvey, C. E. Green, P. A. Kottke, A. G. Fedorov, Y. Joshi, and M. S. Bakir, "3D IC with embedded microfluidic cooling technology, thermal performance, and electrical implications," ASME Journal of Electronic Packaging, vol. 138, pp. 1-6, Mar. 2016.

C. Green, P. Kottke, X. Han, C. Woodrum, T. E. Sarvey, P. Asrar, X. Zhang, Y. Joshi, A. Fedorov, S. Sitaraman, M. S. Bakir, "A review of two-phase forced cooling in three-dimensional stacked electronics: technology integration," ASME Journal of Electronic Packaging, vol 137, pp. 1-9, Dec. 2015.

X. Zhang, V. Kumar, R. Alapati, A. Naeemi and M. S. Bakir, "Interconnect performance in 3D ICs accounting TSV frequency-dependent capacitance and resistive on-chip wires: model, fabrication, and testing," in Proc. SRC Techcon, Austin, TX, Sep. 2015.

. X. Zhang, X. Han, T. E. Sarvey, C. E. Green, P. A. Kottke, A. G. Fedorov, Y. Joshi, and M. S. Bakir, "3D IC with embedded microfluidic cooling: technology, thermal performance, and electrical implications," in Proc. Int. Tech. Conf. and Expo. Packaging and Integration of Electronic and Photonic Microsystems and Int. Conf. Nanochannels, Microchannels, and Minichannels (InterPACKICNMM), San Francisco, CA, July 2015.

L. Zheng, Y. Zhang, X. Zhang, and M. Bakir, "Silicon interposer with embedded microfluidic cooling for high-performance computing systems," in Proc. 65th IEEE Electronic Components and Technology Conf. (ECTC), San Diego, CA, May 2015.