H. Oh, P. A. Thadesar, G. S. May, and M. S. Bakir, "Low-Loss Air-Isolated Through-Silicon Vias for Silicon Interposers," IEEE Microw. Wirel. Components Lett., vol. 26, no. 3, pp. 168-170, Mar. 2016.

P. Thadesar and M. S. Bakir, "Fabrication and characterization of polymer-enhanced TSVs, inductors and antennas for mixed-signal silicon interposer platforms," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 6, no. 3, pp. 455-463, Mar. 2016.

P. Thadesar, X. Gu, R. Alapati and M. S. Bakir, "TSVs: Drivers, performance and innovations (Invited)," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no. 3, pp. 455-463, July 2016.

X. Liu, P. Thadesar, C. Taylor, M. Kunz, N. Tamura, M. Bakir, and S. Sitaraman, "Experimental stress characterization and numerical simulation for copper pumping analysis of through silicon vias (Invited)," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 6, no. 7, pp. 993-999, July 2016

 M. Zia, T. Chi, C. Zhang, P. Thadesar, T. Hookway, J. Gonzalez, T. McDevitt, H. Wang, and M. S. Bakir, "A microfabricated electronic microplate platform for low-cost repeatable bio-sensing applications," in Proc. IEEE International Electron Devices Meeting (IEDM), Washington, DC, Dec. 2015.

. M. Zia, C. Zhang, P. Thadesar, T. Hookway, T. Chi, J. Gonzalez, T. McDevitt, H. Wang,  and M. S. Bakir, "Fabrication of and cell growth on silicon membranes with high density TSVs for bio-sensing applications," in Proc. IEEE Biomedical Circuits and Systems Conference (BioCAS), Atlanta, GA, Oct. 2015.

T. E. Sarvey, Y. Zhang, L. Zheng, P. Thadesar, R. Gutala, C. Cheung, A. Rahman, M. S. Bakir, "Embedded cooling technologies for densely integrated electronic systems," in Proc. IEEE Custom Integrated Circuits Conf. (CICC), Oct. 2015. (invited)

X. Zhang, V. Kumar, R. Alapati, A. Naeemi and M. S. Bakir, "Interconnect performance in 3D ICs accounting TSV frequency-dependent capacitance and resistive on-chip wires: model, fabrication, and testing," in Proc. SRC Techcon, Austin, TX, Sep. 2015.

P. Thadesar and M. Bakir, "Fabrication and characterization of mixed-signal polymer-enhanced silicon interposer featuring photodefined coax TSVs and high-Q inductors," in Proc. 65th IEEE Electronic Components and Technology Conf. (ECTC), San Diego, CA, May 2015.

C. Zhang, P. Thadesar, M. Zia, T. E. Sarvey, and M. S. Bakir, "Au-NiW mechanically flexible interconnects (MFIs) for rematable 3D integration," in Proc. IEEE Int. 3D Systems Integration Conf. (3DIC), Cork, Ireland, Dec. 2014.

X. Liu, P. Thadesar, C. Taylor, H. Oh, M. Kunz, N. Tamura, M. Bakir, and S. Sitaraman, "In-situ microscale through-silicon via strain measurements by synchrotron x-ray microdiffraction exploring the physics behind data interpretation," Applied Physics Letters, vol.105, no.11, p.112109, Sep. 2014.

J. M. Gu, P. Thadesar, A. Dembla, M. S. Bakir, G. S. May, and S. J. Hong "Endpoint detection in low open area TSV fabrication using optical emission spectroscopy," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 4, no. 7, pp. 1251-1260, July 2014.

P. Thadesar, L. Zheng, and M. Bakir, "Low-loss silicon interposer for three-dimensional system integration with embedded microfluidic cooling," in Proc. IEEE VLSI Technology Symposium, Honolulu, HI, June 2014.

Best in Session Paper Award: P. Thadesar and M. Bakir "Fabrication and wideband characterization of novel photodefined polymer-embedded vias for silicon interposers," in Proc. SRC TECHCON, Austin, TX, Sep. 2013.

X. Liu, P. Thadesar, C. Taylor, M. Kunz, N. Tamura, M. Bakir, and S. Sitaraman, "Dimension and liner dependent thermomechanical strain characterization of through-silicon vias using synchrotron x-ray diffraction," Journal of Applied Physics, vol. 114, no. 6, pp. 064908, Aug. 2013.

P. Thadesar and M. Bakir, "Novel photo-defined polymer-enhanced through-silicon vias for silicon interposers," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 3, no. 7, pp. 1130-1137, July 2013.

X. Liu, P. Thadesar, C. Taylor, M. Kunz, N. Tamura, M. Bakir, and S. Sitaraman, "Thermomechanical strain measurements by synchrotron x-ray diffraction and data interpretation for through-silicon vias," Applied Physics Letters , vol. 103, no. 2, pp. 022107-1-022107-5, July 2013.

P. Thadesar, A. Dembla, D. Brown, and M. S. Bakir, "Novel through-silicon via technologies for 3D system integration," in Proc. IEEE International Interconnect Technology Conf. (IITC), Kyoto, Japan, June 2013.

J. M. Gu, P. Thadesar, A. Dembla, S. J. Hong, M. S. Bakir, and G. May, "Endpoint detection using optical emission spectroscopy in TSV fabrication," in Proc. IEEE International Interconnect Technology Conf. (IITC), Kyoto, Japan, June 2013.

P. Thadesar, J. M. Gu, A. Dembla, S. J. Hong, G. S. May and M. S. Bakir, "Novel photodefined polymer-clad through-silicon via technology integrated with end point detection using optical emission spectroscopy," in Proc. 24th Annual SEMI Advanced Semiconductor Manufacturing Conf. (ASMC), Saratoga Springs, NY, May 2013.

P. Thadesar and M. Bakir, "Fabrication and characterization of novel photodefined polymer-enhanced through-silicon vias for silicon interposers," in Proc. 63rd IEEE Electronic Components and Technology Conf. (ECTC), Las Vegas, NV, May 2013.

H. S. Yang, P. Thadesar, C. Zhang, M.S. Bakir, (2013). Mechanically Flexible Interconnects and TSVs: Applications in CMOS/MEMS Integration. In L. A. Francis and K. Iniewski (Ed.), Novel Advances in Microsystems Technologies and Their Applications (1st ed., p45-p68). FL, USA: CRC Press

P. Thadesar and M. Bakir, "Novel low-loss photodefined electrical TSVs for silicon interposers," Topical Workshop on Advanced 3D Packaging, 9th IMAPS Int. Conf. and Exhibition on Device Packaging, Scottsdale/Fountain Hills, AZ, Mar. 2013.

P. Thadesar and M. Bakir, "Novel photodefined polymer-embedded vias for silicon interposers," Journal of Micromechanics and Microengineering, vol. 23, no. 3, pp. 035003-1-035003-6, Mar. 2013.

H. S. Yang, P. Thadesar, C. Zhang, M.S. Bakir, (2013). Mechanically Flexible Interconnects and TSVs: Applications in CMOS/MEMS Integration. In V. Choudhary and K. Iniewski (Ed.), MEMS: Fundamental Technology and Applications (1st ed., p111-p130). FL, USA: CRC Press

P. Thadesar and M. Bakir, "Silicon interposer featuring novel electrical and optical TSVs," in Proc. ASME International Mechanical Engineering Congress and Exposition, Houston, TX, Nov. 2012.

M. Parekh, P. Thadesar and M. Bakir, "Electrical, optical, and fluidic through-silicon vias for silicon interposer applications," in Proc. 61st IEEE Electronic Components and Technology Conf., Lake Buena Vista, FL, May 2011.

M. Bakir, P. Thadesar, C. King, J. Zaveri, H. Yang, C. Zhang, Y. Zhang, "Revolutionary innovation in system interconnection: A new era for the IC," in Proc. Photonics West, Proc. of SPIE, Feb. 2011.