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Calvin King

  • Ph.D Alumni

 
 
 

Biography

Research Interests

Thesis king_calvin_r_201208_phd.pdf

All Publications

  1. Y. Zhang, C. King, J. Zaveri, Y. J. Kim, V. Sahu, Y. Joshi, and M. Bakir, "Coupled electrical and thermal 3D IC centric microfluidic heat sink design and technology," in Proc. 61st IEEE Electronic Components and Technology Conf. (ECTC), Orlando, FL, May 2011.

  2. M. Bakir, P. Thadesar, C. King, J. Zaveri, H. Yang, C. Zhang, Y. Zhang, "Revolutionary innovation in system interconnection: A new era for the IC," in Proc. Photonics West, Proc. of SPIE, Feb. 2011.

  3. Y. Zhang, J. Zaveri, C. King, and M. Bakir, "Coupled electrical and thermal 3D IC centric microfluid heat sink design," in Proc. SRC Techcon, 2010.

  4. C. King, J. Zaveri, M. Bakir, and J. Meindl, "Electrical and fluidic C4 interconnections for inter-layer liquid cooling of 3D ICs," in Proc. IEEE Electronic Components and Technology Conf., pp. 822-828, 2010.

  5. J. Zaveri, C. King Jr., H.S. Yang, M.S. Bakir, "Wafer level batch fabrication of silicon microchannel heat sinks and electrical through silicon vias for 3D ICs," IMAPS 42nd International Symposium on Microelectronics, 2009.

  6. J. Zaveri, C. King, H. Yang, and M. Bakir, "Wafer level batch fabrication of silicon microchannel heat sinks and electrical through silicon vias" in Proc. SRC TECHCON, 2009.

  7. C. King, J. Zaveri, H. S. Yang, M. Bakir, and J. Meindl "Electro-fluidic C4 interconnections for inter-layer liquid cooling of 3D ICs," in Proc. SRC TECHCON, 2009.

  8. M. S. Bakir, C. King, D. Sekar, and B. Dang, “Electrical, optical, and fluidic interconnect networks for 3D heterogeneous integrated systems,” 2008 IEEE Avionics, Fiber-Optics and Photonics Technology Conference, Sep. 2008.

  9. M. S. Bakir, C. King, D. Sekar, H. Thacker, B. Dang, G. Huang, A. Naeemi, and J. D. Meindl, “3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation,” 2008 IEEE Custom Integrated Circuits Conference, Sep. 2008.

  10. C. King, D. Sekar, M. Bakir, B. Dang, J. Pikarsky, and J. Meindl, "3D stacking of chips with electrical and microfluidic I/O interconnects," in Proc. SRC TECHCON, 2008.

  11. D. Sekar, C. King, B. Dang, T. Spencer, H. Thacker, P. Joseph, M. Bakir, and J. Meindl, “A 3D-IC Technology with Integrated Microchannel Cooling,” 2008 International Interconnect Technology Conference, Jun. 2008.

  12. C. King, D. Sekar, M. Bakir, B. Dang, J. Pikarsky, J. Meindl, "Assembly techniques for microfluidic networks in three-dimensional integrated circuits," SRC TECHCON, 2007.