Biography
• Interdisciplinary researcher specializing in thermal engineering and cooling technology for electronics packaging.
• Doctoral research focused on energy-efficient embedded cooling of high-heat-flux electronics ( > 1 kW/cm^2) using silicon-based manifold microchannel heat sinks.
• Highly experienced in hands-on experiments, including construction of single/two-phase flow loop testbed and MEMS fabrication of cooling devices, along with expertise in computational fluid dynamics (CFD) and reduced-order modeling (ROM).
Research Interests
Embedded liquid cooling for advanced electronics packaging, Electro/thermal co-design