Ph.D. student in Electrical and Computer Engineering, Georgia Institute of Technology
MS in Electrical Engineering, University of Southern California
BS in Electrical Engineering, University of Washington
Research Interests
Thesis
All Publications
S. Oh, Z. Zhang, G. Yan, P. K. Jo and M. S. Bakir, "Heterogeneous Integration Enabled by 3D Stitch-Chips," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3507552.
E. Chung et al., "Electrical-Thermal Co-analysis of Through-Silicon Vias (TSVs) Integrated within Micropin-fin Heatsink for 3D Heterogeneous Integration (HI)," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3452637.
