lab-member-pic
 

Geyu Yan

  • Ph.D Student

 gyan34@gatech.edu
 
 

Biography

  • Ph.D. student in Electrical and Computer Engineering, Georgia Institute of Technology
  • MS in Electrical Engineering, University of Southern California
  • BS in Electrical Engineering, University of Washington

Research Interests

Thesis

All Publications

  1. J. Lu, M. Zia, D. A. Baig, G. Yan, J.J. Kim, K. Nagapudi, P. Anschutz, S. Oh, D. H. O'Connor, S. J. Sober, and M. S. Bakir, "Opto-Myomatrix: μLED integrated microelectrode arrays for optogenetic activation and electrical recording in muscle tissue," bioRxiv, preprint, 2024. doi: 10.1101/2024.07.01.601601.

  2. G. Yan, E. Chung, E. Masselink, S. Oh, M, Zia, B Ramakrishnan, V. Oruganti, H. Alissa, C. Belady, Y. Im, Y. Joshi, and M. S. Bakir., "Toward TSV-Compatible Microfluidic Cooling for 3D ICs," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3516653.  (Early Access)

  3. S. Oh, Z. Zhang, G. Yan, P. K. Jo and M. S. Bakir, "Heterogeneous Integration Enabled by 3-D Stitch-Chips," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 15, no. 1, pp. 113-122, Jan. 2025, doi: 10.1109/TCPMT.2024.3507552.

  4. E. Chung, G. Yan, S. Oh, B. Ramakrishnan, H. Alissa, V. Oruganti, C. Belady, and M. S. Bakir., "Electrical–Thermal Co-Analysis of Through-Silicon Vias (TSVs) Integrated Within Micropin-Fin Heatsink for 3-D Heterogeneous Integration (HI)," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 10, pp. 1792-1802, Oct. 2024, doi: 10.1109/TCPMT.2024.3452637.

  5. E. Chung, G. Yan, B. Ramakrishnan, H. Alissa, V. Oruganti, C. Belady, E. Masselink , and M. S. Bakir., "Electrical-Thermal Co-analysis of TSV Embedded Microfluidic Pin-fin Heatsink for High Power Dissipation with High Bandwidth Density," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 1479-1484, doi: 10.1109/ECTC51529.2024.00240.