lab-member-pic
 

Madison Manley

  • Ph.D Candidate

 madison.manley@gatech.edu
 
 

Biography

Madison is currently a Ph.D. student in the Electrical and Computer Engineering program at Georgia Tech. She received her bachelor's in electrical engineering at the University of Central Florida.

Research Interests

Thesis

All Publications

  1. J. Sharda, M. Manley, A. Kaul, W. Li, M. Bakir and S. Yu, "Design and Thermal Analysis of 2.5D and 3D Integrated System of a CMOS Image Sensor and a Sparsity-Aware Accelerator for Autonomous Driving," in IEEE Journal of the Electron Devices Society, doi: 10.1109/JEDS.2024.3354621

  2. A. Kaul, M. O. Hossen, M. Manley and M. S. Bakir, "Design Considerations for Power Delivery Network and Metal-Insulator-Metal Capacitor Integration in Bridge-Chips for 2.5-D Heterogeneous Integration," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 985-990.​

  3. M. Manley et al., "Towards Selective Cobalt Atomic Layer Deposition for Chip-to-Wafer 3D Heterogeneous Integration," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 374-378.

  4. W. Li, M. Manley, J. Read, A. Kaul, M. S. Bakir and S. Yu, "H3DAtten: Heterogeneous 3-D Integrated Hybrid Analog and Digital Compute-in-Memory Accelerator for Vision Transformer Self-Attention," in IEEE Transactions on Very Large Scale Integration (VLSI) Systems, doi: 10.1109/TVLSI.2023.3299509.

  5. A. Victor, M. Manley, S. Oh and M. S. Bakir, "Reconstituted-SiO2 Tier with Integrated Copper Heat Spreader," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 1767-1772, doi: 10.1109/ECTC51909.2023.00302.

  6. J. Sharda, M. Manley, A. Kaul, W. Li, M. Bakir, S. Yu, “Thermal modeling of 2.5D integrated package of CMOS image sensor and FPGA for autonomous driving,” IEEE Electron Devices Technology and Manufacturing Conference (EDTM) 2023, Seoul, Korea.

  7. T. Zheng, M. Manley and M. Bakir, "Embedded mm-Wave Chiplet Based Module using Fused-Silica Stitch-Chip Technology: RF Characterization and Thermal Evaluation," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, May 2023, pp. 1493-1498.

  8. A. Kaul, Y. Luo, X. Peng, M. Manley, Y.-C. Luo, S. Yu and M. S. Bakir, "3-D Heterogeneous Integration of RRAM-Based Compute-In-Memory: Impact of Integration Parameters on Inference Accuracy," in IEEE Transactions on Electron Devices, vol. 70, no. 2, pp. 485-492, Feb. 2023, doi: 10.1109/TED.2022.3231570.

  9. A. Victor, M. Manley, S. Oh and M. S. Bakir, "Reconstituted-SiO2 Tier with Integrated Copper Heat Spreader," in Proceedings of SRC TECHCON 2022, Austin, TX, USA, 2022.

  10. Z. J. Devereaux, M. Manley, M.-J. Li, J. Hollin, N. M. K. Linn, M. S. Bakir, A. Kummel and C. H. Winter, “Studies Toward Highly Selective Cobalt Metal ALD on Copper Features for Heterogeneous Chiplet Integration”, 6th Area Selective Deposition Workshop, San Francisco, CA, Apr. 2022.​

  11. M. Manley, A. Kaul, M. -J. Li and M. S. Bakir, "Ultra-Dense 3D Polylithic Integration Technology", Government Microcircuit Applications & Critical Technology Conf., Miami, FL, Mar. 2022.