lab-member-pic
 

Geyu Yan

  • Ph.D Student

 gyan34@gatech.edu
 
 

Biography

  • Ph.D. student in Electrical and Computer Engineering, Georgia Institute of Technology
  • MS in Electrical Engineering, University of Southern California
  • BS in Electrical Engineering, University of Washington

Research Interests

Thesis

All Publications

  1. G. Yan, E. Chung, E. Masselink, S. Oh, M, Zia, B Ramakrishnan, V. Oruganti, H. Alissa, C. Belady, Y. Im, Y. Joshi, and M. S. Bakir., "Toward TSV-Compatible Microfluidic Cooling for 3D ICs," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3516653.  (Early Access)

  2. S. Oh, Z. Zhang, G. Yan, P. K. Jo and M. S. Bakir, "Heterogeneous Integration Enabled by 3D Stitch-Chips," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3507552.

  3. E. Chung et al., "Electrical-Thermal Co-analysis of Through-Silicon Vias (TSVs) Integrated within Micropin-fin Heatsink for 3D Heterogeneous Integration (HI)," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3452637.

  4. E. Chung et al., "Electrical-Thermal Co-analysis of TSV Embedded Microfluidic Pin-fin Heatsink for High Power Dissipation with High Bandwidth Density," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 1479-1484, doi: 10.1109/ECTC51529.2024.00240. keywords: {Three-dimensional displays;Thermal resistance;Bandwidth;Thermal analysis;Power dissipation;Through-silicon vias;Heat sinks;3D integration;computational fluid dynamics (CFD);through-silicon via (TSV);multi-objective optimization},