lab-member-pic
 

Shane Oh

  • Ph.D Candidate

 shaneoh@gatech.edu
 
 

Biography

  • PhD student in Electrical and Computer Engineering, Georgia Institute of Technology
  • B.S. in Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 2020
     

Research Interests

Thesis

All Publications

  1. Z. Zhang, P. K. Jo, S. Oh and M. S. Bakir, "Direct Die-to-die Bridging for Heterogeneous mm-wave Circuits Enabled by Fused-Silica Stitch-Chip Technology," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2025.3587609.

  2. J. Lu, M. Zia, D. A. Baig, G. Yan, J.J. Kim, K. Nagapudi, P. Anschutz, S. Oh, D. H. O'Connor, S. J. Sober, and M. S. Bakir, "Opto-Myomatrix: μLED integrated microelectrode arrays for optogenetic activation and electrical recording in muscle tissue," bioRxiv, preprint, 2024. doi: 10.1101/2024.07.01.601601.

  3. G. Yan, E. Chung, E. Masselink, S. Oh, M, Zia, B Ramakrishnan, V. Oruganti, H. Alissa, C. Belady, Y. Im, Y. Joshi, and M. S. Bakir., "Toward TSV-Compatible Microfluidic Cooling for 3D ICs," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3516653.  (Early Access)

  4. S. Oh, Z. Zhang, G. Yan, P. K. Jo and M. S. Bakir, "Heterogeneous Integration Enabled by 3-D Stitch-Chips," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 15, no. 1, pp. 113-122, Jan. 2025, doi: 10.1109/TCPMT.2024.3507552.

  5. E. Chung, G. Yan, S. Oh, B. Ramakrishnan, H. Alissa, V. Oruganti, C. Belady, and M. S. Bakir., "Electrical–Thermal Co-Analysis of Through-Silicon Vias (TSVs) Integrated Within Micropin-Fin Heatsink for 3-D Heterogeneous Integration (HI)," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 10, pp. 1792-1802, Oct. 2024, doi: 10.1109/TCPMT.2024.3452637.

  6. R. Krishna, Z. Peng, A. Hosseinnia, S. Oh, M. Bakir, and A. Adibi, "Silicon Nitride-based CMOS-photonic Devices Using High-Q Resonators," in 2024 Conference on Lasers and Electro-Optics (CLEO), 2024: IEEE, pp. 1-2. 

  7. M. A. Nieves Calderon, S. Oh, J. R. Brescia and M. S. Bakir, "Multi-Chiplet Implementation of a Replaceable Integrated Chiplet (PINCH) Assembly," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 3, pp. 529-532, March 2024, doi: 10.1109/TCPMT.2024.3363652.

  8. S. Oh, T. Zheng and M. S. Bakir, "Electrical Characterization of Shielded TSVs With Airgap Isolation for RF/mmWave Applications," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 2, pp. 202-210, Feb. 2024, doi: 10.1109/TCPMT.2024.3358102.

  9. A. Victor, M. Manley, S. Oh and M. S. Bakir, "Reconstituted-SiO2 Tier with Integrated Copper Heat Spreader," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 1767-1772, doi: 10.1109/ECTC51909.2023.00302.

  10. A. Victor, M. Manley, S. Oh and M. S. Bakir, "Reconstituted-SiO2 Tier with Integrated Copper Heat Spreader," in Proceedings of SRC TECHCON 2022, Austin, TX, USA, 2022.