lab-member-pic
 

Shane Oh

  • Ph.D Candidate

 shaneoh@gatech.edu
 
 

Biography

(he/him)

  • PhD student in Electrical and Computer Engineering, Georgia Institute of Technology
  • B.S. in Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 2020
     

Research Interests

Thesis

All Publications

  1. S. Oh, Z. Zhang, G. Yan, P. K. Jo and M. S. Bakir, "Heterogeneous Integration Enabled by 3D Stitch-Chips," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3507552.

  2. E. Chung et al., "Electrical-Thermal Co-analysis of Through-Silicon Vias (TSVs) Integrated within Micropin-fin Heatsink for 3D Heterogeneous Integration (HI)," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3452637.

  3. M. A. Nieves Calderon, S. Oh, J. R. Brescia and M. S. Bakir, "Multi-Chiplet Implementation of a Replaceable Integrated Chiplet (PINCH) Assembly," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 3, pp. 529-532, March 2024, doi: 10.1109/TCPMT.2024.3363652

  4. S. Oh, T. Zheng and M. S. Bakir, "Electrical Characterization of Shielded TSVs with Airgap Isolation for RF/mmWave Applications," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3358102.

  5. A. Victor, M. Manley, S. Oh and M. S. Bakir, "Reconstituted-SiO2 Tier with Integrated Copper Heat Spreader," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 1767-1772, doi: 10.1109/ECTC51909.2023.00302.

  6. A. Victor, M. Manley, S. Oh and M. S. Bakir, "Reconstituted-SiO2 Tier with Integrated Copper Heat Spreader," in Proceedings of SRC TECHCON 2022, Austin, TX, USA, 2022.