G. Yan, E. Chung, E. Masselink, S. Oh, M, Zia, B Ramakrishnan, V. Oruganti, H. Alissa, C. Belady, Y. Im, Y. Joshi, and M. S. Bakir., "Toward TSV-Compatible Microfluidic Cooling for 3D ICs," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3516653.  (Early Access)

S. Oh, Z. Zhang, G. Yan, P. K. Jo and M. S. Bakir, "Heterogeneous Integration Enabled by 3D Stitch-Chips," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3507552.

E. Chung et al., "Electrical-Thermal Co-analysis of Through-Silicon Vias (TSVs) Integrated within Micropin-fin Heatsink for 3D Heterogeneous Integration (HI)," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3452637.

R. Krishna, Z. Peng, A. Hosseinnia, S. Oh, M. Bakir, and A. Adibi, "Silicon Nitride-based CMOS-photonic Devices Using High-Q Resonators," in 2024 Conference on Lasers and Electro-Optics (CLEO), 2024: IEEE, pp. 1-2. 

M. A. Nieves Calderon, S. Oh, J. R. Brescia and M. S. Bakir, "Multi-Chiplet Implementation of a Replaceable Integrated Chiplet (PINCH) Assembly," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 3, pp. 529-532, March 2024, doi: 10.1109/TCPMT.2024.3363652

S. Oh, T. Zheng and M. S. Bakir, "Electrical Characterization of Shielded TSVs with Airgap Isolation for RF/mmWave Applications," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3358102.

A. Victor, M. Manley, S. Oh and M. S. Bakir, "Reconstituted-SiO2 Tier with Integrated Copper Heat Spreader," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 1767-1772, doi: 10.1109/ECTC51909.2023.00302.

A. Victor, M. Manley, S. Oh and M. S. Bakir, "Reconstituted-SiO2 Tier with Integrated Copper Heat Spreader," in Proceedings of SRC TECHCON 2022, Austin, TX, USA, 2022.