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Shane Oh

  • Ph.D Candidate

 shaneoh@gatech.edu
 
 

Biography

  • PhD student in Electrical and Computer Engineering, Georgia Institute of Technology
  • B.S. in Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 2020
     

Research Interests

Thesis

All Publications

  1. J. Lu, M. Zia, D. A. Baig, G. Yan, J.J. Kim, K. Nagapudi, P. Anschutz, S. Oh, D. H. O'Connor, S. J. Sober, and M. S. Bakir, "Opto-Myomatrix: μLED integrated microelectrode arrays for optogenetic activation and electrical recording in muscle tissue," bioRxiv, preprint, 2024. doi: 10.1101/2024.07.01.601601.

  2. G. Yan, E. Chung, E. Masselink, S. Oh, M, Zia, B Ramakrishnan, V. Oruganti, H. Alissa, C. Belady, Y. Im, Y. Joshi, and M. S. Bakir., "Toward TSV-Compatible Microfluidic Cooling for 3D ICs," in IEEE Transactions on Components, Packaging and Manufacturing Technology, doi: 10.1109/TCPMT.2024.3516653.  (Early Access)

  3. S. Oh, Z. Zhang, G. Yan, P. K. Jo and M. S. Bakir, "Heterogeneous Integration Enabled by 3-D Stitch-Chips," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 15, no. 1, pp. 113-122, Jan. 2025, doi: 10.1109/TCPMT.2024.3507552.

  4. E. Chung, G. Yan, S. Oh, B. Ramakrishnan, H. Alissa, V. Oruganti, C. Belady, and M. S. Bakir., "Electrical–Thermal Co-Analysis of Through-Silicon Vias (TSVs) Integrated Within Micropin-Fin Heatsink for 3-D Heterogeneous Integration (HI)," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 10, pp. 1792-1802, Oct. 2024, doi: 10.1109/TCPMT.2024.3452637.

  5. R. Krishna, Z. Peng, A. Hosseinnia, S. Oh, M. Bakir, and A. Adibi, "Silicon Nitride-based CMOS-photonic Devices Using High-Q Resonators," in 2024 Conference on Lasers and Electro-Optics (CLEO), 2024: IEEE, pp. 1-2. 

  6. M. A. Nieves Calderon, S. Oh, J. R. Brescia and M. S. Bakir, "Multi-Chiplet Implementation of a Replaceable Integrated Chiplet (PINCH) Assembly," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 3, pp. 529-532, March 2024, doi: 10.1109/TCPMT.2024.3363652.

  7. S. Oh, T. Zheng and M. S. Bakir, "Electrical Characterization of Shielded TSVs With Airgap Isolation for RF/mmWave Applications," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 2, pp. 202-210, Feb. 2024, doi: 10.1109/TCPMT.2024.3358102.

  8. A. Victor, M. Manley, S. Oh and M. S. Bakir, "Reconstituted-SiO2 Tier with Integrated Copper Heat Spreader," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 1767-1772, doi: 10.1109/ECTC51909.2023.00302.

  9. A. Victor, M. Manley, S. Oh and M. S. Bakir, "Reconstituted-SiO2 Tier with Integrated Copper Heat Spreader," in Proceedings of SRC TECHCON 2022, Austin, TX, USA, 2022.