Y. Zhang, M. O. Hossen, and M. S. Bakir, "Power delivery network modeling and benchmarking for emerging heterogeneous integration technologies," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 9, pp. 1825-1834, 2019.

Y. Zhang, X. Zhang, and M. S. Bakir, "Benchmarking Digital Die-to-Die Channels in 2.5-D and 3-D Heterogeneous Integration Platforms," IEEE Transactions on Electron Devices, vol. 65, no. 12, pp. 5460-5467, 2018.

M. O. Hossen, Y. Zhang, and M. Bakir, "Thermal-Power Delivery Network Co-analysis for Multi-Die Integration", in 27th IEEE Conf. on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA, Oct. 2018.

P. K. Jo, M. O. Hossen, X. Zhang, Y. Zhang, and M. S. Bakir, "Heterogeneous Multi-Die Stitching: Technology Demonstration and Design Considerations," in Proc. 68th IEEE Electronic Components and Technology Conf. (ECTC), San Diego, CA, May. 2018.

Y. Zhang, M. O. Hossen, and M. S. Bakir, "Power Delivery Network Benchmarking For Interposer and Bridge-chip Based 2.5-D Integration," in IEEE Electron Device Letters, vol. 39, no. 1, pp. 99-102, Dec. 2017

T. E. Sarvey, Y. Zhang, C. Cheung, R. Gutala. A. Rahman, A. Dasu, and M. S. Bakir, "Monolithic integration of a micropin-fin heat sink in a 28 nm FPGA," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 9, pp. 1465-1475, Sep. 2017.

Y. Zhang, T. E. Sarvey, and M. S. Bakir, "Thermal evaluation of 2.5-D integration using bridge-chip technology challenges and opportunities", IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 7, pp. 1101 - 1110, July 2017.

Y. Zhang and M. S. Bakir, "Integrated thermal and power delivery network co-simulation framework for single-die and multi-die assemblies", IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 7, no. 3, pp. 434-443, Feb. 2017.

Y. Zhang, X. Zhang, W. Wahby, and M. S. Bakir, "Design considerations for 2.5-D and 3-D integration accounting for thermal constraints," in Proc. IEEE Int. 3D Systems Integration Conf. (3DIC), San Francisco, CA, Nov. 2016.

Y. Zhang, T. E. Sarvey, Y. Zhang, M. Zia and M. S. Bakir, "Numerical and experimental exploration of thermal isolation in 3D systems using air gap and mechanically flexible interconnects," in IEEE International Interconnect Technology Conf. / Advanced Metallization Conf. (IITC/AMC), San Jose, CA, May. 2016.

L. Zheng, Y. Zhang, and M. Bakir, "Full-Chip Power Supply Noise Time-Domain Numerical Modeling and Analysis for Single and Stacked ICs," IEEE Transaction on Electron Devices, vol. 63, no. 3, pp. 1225-1231, Mar. 2016.

W. Wahby, L. Zheng, Y. Zhang, M. S. Bakir, "A simulation tool for rapid investigation of trends in 3DIC performance and power consumption," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no. 2, pp. 192-199, Feb. 2016.

Y. Zhang, Y. Zhang, T. E. Sarvey, C. Zhang, M. Zia, M. S. Bakir, "Thermal isolation using air gap and mechanically flexible interconnects for heterogeneous 3D ICs," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 6. no. 1, pp. 31-39, Dec. 2015.

L. Zheng, Y. Zhang, and M. Bakir, "A Silicon interposer platform utilizing microfluidic cooling for high-performance computing systems," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 5, pp. 1379-1386, Oct. 2015.

T. E. Sarvey, Y. Zhang, L. Zheng, P. Thadesar, R. Gutala, C. Cheung, A. Rahman, M. S. Bakir, "Embedded cooling technologies for densely integrated electronic systems," in Proc. IEEE Custom Integrated Circuits Conf. (CICC), Oct. 2015. (invited)

L. Zheng, Y. Zhang, X. Zhang, and M. Bakir, "Silicon interposer with embedded microfluidic cooling for high-performance computing systems," in Proc. 65th IEEE Electronic Components and Technology Conf. (ECTC), San Diego, CA, May 2015.

Y. Zhang, T. E. Sarvey, and M. S. Bakir, "Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation," in Proc. IEEE Int. 3D Systems Integration Conf. (3DIC), Cork, Ireland, Dec. 2014.

Y. Zhang, Y. Zhang, M. S. Bakir, "Thermal design and constraints for heterogeneous integrated chip stacks and isolation technology using air gap and thermal bridge," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol.4, no.12, pp.1914-1924, Dec. 2014.

T. E. Sarvey, Y. Zhang, Y. Zhang, H. Oh, and M. S. Bakir, "Thermal and electrical effects of staggered micropin-fin dimensions for cooling of 3D microsystems,"in IEEE Intersociety Conf. on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), Orlando, FL, May 2014.