C. Zhang, H. S. Yang, and M. S. Bakir, "A double-lithography and double-reflow process and application to multi-pitch multi-height mechanical flexible interconnects," Journal of Micromechanics and Microengineering, vol. 27, no. 2, pp. 025014-1-025014-6, Jan. 2017.

M. Zia, C. Zhang, H.S. Yang, L. Zheng and Muhannad Bakir, "Chip-to-chip interconnect integration technologies," IEICE Electron. Express, vol. 13, no. 6, pp. 1-16, Mar. 2016.

H. S. Yang, C. Zhang, and M. S. Bakir, "A self-aligning flip-chip assembly method using sacrificial positive self-alignment structures," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 6, no. 3, pp. 471-477, Feb. 2016.

C. Zhang, H. S. Yang, H. D. Thacker, I. Shubin, J. E. Cunningham, and M. S. Bakir, "Mechanically flexible interconnects with contact tip for rematable heterogeneous system integration," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 6, no. 11, pp. 1587-1594, Oct. 2016.

H. S. Yang, C. Zhang, and M. Bakir, "Self-aligned silicon interposer tiles and silicon bridges using positive self-alignment structures and rematable mechanically flexible interconnects", IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 4, no. 11, pp. 1760-1768, Nov. 2014.

H. S. Yang, C. Zhang, and M. Bakir, "Self-aligning silicon interposer tiles and silicon bridges for large nanophotonics enabled systems", Electronics Letters, vol. 50, no. 20, pp. 1475-1477, Sep. 2014.

C. Zhang, H.S. Yang, M. Bakir, "Mechanically flexible interconnects with highly scalable pitch and large stand-off height for silicon interposer tile and bridge interconnection," in Proc. 64th IEEE Electronic Components and Technology Conf. (ECTC), Orlando, FL, May 2014.

H. S. Yang, C. Zhang, M. Zia, L. Zheng, M. Bakir, "Interposer-to-interposer electrical and silicon photonic interconnection platform using silicon bridge," in Proc. IEEE Photonics Society Optical Interconnects Conf., Coronado, CA, May 2014.

C. Zhang, H. S. Yang, and M. Bakir, "Mechanically flexible interconnects (MFIs) with highly scalable pitch," Journal of Micromechanics and Microengineering, vol. 24, no. 5, pp. 055024, May 2014.

C. Zhang, H. S. Yang, and M. Bakir, "Highly elastic gold passivated mechanically flexible interconnects," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol. 3, no. 10, pp. 1632-1639, Oct. 2013.

H.S. Yang, C. Zhang, M.S. Bakir, "A low-cost self-alignment structures for heterogeneous 3D integration," in Proc. 63rd IEEE Electronic Components and Technology Conf. (ECTC), Las Vegas, NV, May 2013.

H. S. Yang, P. Thadesar, C. Zhang, M.S. Bakir, (2013). Mechanically Flexible Interconnects and TSVs: Applications in CMOS/MEMS Integration. In L. A. Francis and K. Iniewski (Ed.), Novel Advances in Microsystems Technologies and Their Applications (1st ed., p45-p68). FL, USA: CRC Press

H. S. Yang, P. Thadesar, C. Zhang, M.S. Bakir, (2013). Mechanically Flexible Interconnects and TSVs: Applications in CMOS/MEMS Integration. In V. Choudhary and K. Iniewski (Ed.), MEMS: Fundamental Technology and Applications (1st ed., p111-p130). FL, USA: CRC Press

C. Zhang, H. S. Yang, and M. Bakir, "Gold passivated mechanically flexible interconnects (MFIs) with high elastic deformation," in Proc. 62nd IEEE Electronic Components and Technology Conf. (ECTC), San Diego, CA, 2012.

H. S. Yang, M. S. Bakir, "Design, fabrication, and characterization of freestanding mechanically flexible interconnects using curved sacrificial layer," IEEE Transaction on Components, Packaging and Manufacturing Technology, vol.2, no.4, pp.561-568, Apr. 2012

H. S. Yang, R. Ravindran, C. Zhang, P. Modarres, and M. Bakir, "Enabling technologies for 3D stacking of disposable electronic biosensor and CMOS Chips," Future Fab International, pp. 80-85, Oct. 2011. (invited)

H. S. Yang and M. Bakir, "Design and wafer-level fabrication of positive self-alignment structures for improved vertical optical coupling," in IMAPS/IEEE-CPMT Advanced Technology Workshop on Optoelectronic Packaging, Irvine, CA, June 2011.

M. Bakir, P. Thadesar, C. King, J. Zaveri, H. Yang, C. Zhang, Y. Zhang, "Revolutionary innovation in system interconnection: A new era for the IC," in Proc. Photonics West, Proc. of SPIE, Feb. 2011.

H. S. Yang and M. Bakir, "3D integration of CMOS and MEMS using MFI and TSV," in Proc. SRC Techcon, 2010.

H. S. Yang and M. Bakir, "3D integration of CMOS and MEMS using mechanically flexible interconnects (MFI) and through silicon vias (TSV)," in Proc. IEEE Electronic Components and Technol. Conf., pp. 822-828, 2010.

R. Ravindran, J. A. Sadie, K. E. Scarberry, H. S. Yang, M. S. Bakir, J. F. McDonald, and J. D. Meindl, "Biochemical sensing with an arrayed silicon nanowire platform," in Proc. IEEE Electronic Components and Technol. Conf., pp. 1015-1020, 2010.

H. S. Yang, R. Ravindran, M. S. Bakir, J.D. Meindl, "A 3D interconnect system for large biosensor array and CMOS signal-processing IC integration," IEEE Interconnect Technology Conf. (IITC), 2010 International, 6-9 June 2010

H. S. Yang and M. Bakir, "Interconnect technologies for 3D integration of CMOS and MEMS," in Proc. MRS Spring Meeting, 2010. (invited)

J. Zaveri, C. King Jr., H.S. Yang, M.S. Bakir, "Wafer level batch fabrication of silicon microchannel heat sinks and electrical through silicon vias for 3D ICs," IMAPS 42nd International Symposium on Microelectronics, 2009.

C. King, J. Zaveri, H. S. Yang, M. Bakir, and J. Meindl "Electro-fluidic C4 interconnections for inter-layer liquid cooling of 3D ICs," in Proc. SRC TECHCON, 2009.

J. Zaveri, C. King, H. Yang, and M. Bakir, "Wafer level batch fabrication of silicon microchannel heat sinks and electrical through silicon vias" in Proc. SRC TECHCON, 2009.